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Sizzix Accessories - Die Brush & Foam Pad for Wafer-Thin Dies

$15.00

Sizzix Accessories - Die Brush & Foam Pad for Wafer-Thin Dies

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically.

With a sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability  the Die Brush easily rolls away excess paper to reveal the perfect cut!

The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

Includes
1 Die Brush,
1 Foam Pad
Product Dimensions
Die Brush: 5 1/2" x 1 3/4" x 1/4".
Foam Pad: 4 1/2" x 7 1/4".

    VIDEO below:

    Die cutting just got easier! Clean the paper pieces out of your dies in a snap with this Die Brush Tool from Sizzix.


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